Thermal pad Gelid Extreme TP-GP01-F 80×40×2.5 mm by Gelid

Gelid Extreme TP-GP01-F thermal pad is a soft, gap-filling thermal interface material sized 80×40×2.5 mm and intended to improve heat transfer between electronic components and heatsinks. The pad's uniform thermal compound composition provides a stable conductive layer that helps bridge uneven surfaces and maintain consistent contact where a 2.5 mm thickness is required. It is suitable for use in PC cooling, power electronics assemblies and compact devices that need reliable thermal conduction without liquid or grease.

Advantages

The Gelid Extreme pad offers consistent thermal conductivity across its area and compressible compliance to accommodate small surface irregularities. Its solid form eliminates the risk of leakage or pump-out typical of liquid thermal pastes while simplifying installation and replacement. The pad's fixed thickness of 2.5 mm ensures repeatable spacing between components and heatsinks, supporting predictable thermal performance in constrained assemblies.

Suitable for

• Filling gaps between chips, MOSFETs, regulators and heatsinks in PC motherboards and power stages
• Thermal management in compact enclosures and small form-factor PCs
• Cooling interfaces in power electronics, LED modules and other electronic assemblies

Key specifications

• Dimensions: 80 × 40 × 2.5 mm
• Material type: soft thermal interface pad (solid, non-liquid)
• Form factor: rectangular sheet suitable for cutting to size
• Function: gap-filling thermal conductor between component and heatsink

How to use

Clean and degrease the contact surfaces before application to ensure optimal thermal transfer. Measure and, if necessary, trim the pad to the required shape using clean scissors or a sharp blade. Place the pad between the component and the heatsink, align carefully to avoid shifting, then mount the heatsink and apply even pressure according to the equipment manufacturer's instructions. Ensure that mounting pressure compresses the pad sufficiently to establish full surface contact without exceeding mechanical limits of the components.

Usage recommendations

Store the thermal pad in a dry, dust-free environment and avoid prolonged exposure to extreme temperatures or direct sunlight. When replacing the pad, inspect mating surfaces for contamination or damage and clean as needed. For high-vibration or high-current applications, verify mechanical fixation and thermal performance during initial testing.