Thermal pad Gelid GP-Extreme 120×120×0.5 mm, density 2.8 g/cm³

Gelid GP-Extreme 120×120×0.5 mm is a preformed thermal pad engineered to create a compliant thermal interface between electronic components and heatsinks. With a thickness of 0.5 mm and a density of 2.8 g/cm³, this single-piece pad is intended for use where gap filling and reliable heat conduction are needed without the use of liquid thermal compound. The pad is soft, non-electrically conductive, non-corrosive, non-curing and non-toxic, and its 120×120 mm size fits larger PCBs and densely packed assemblies found in GPUs, laptops and gaming consoles.

Advantages

The GP-Extreme thermal pad provides consistent heat transfer across uneven surfaces and differing component heights by conforming to surface irregularities. Its high density and material composition enable improved thermal contact compared with harder interface materials while avoiding electrical conductivity and curing-related issues. Supplied as a single, easy-to-handle sheet, it simplifies installation and reduces the risk of mess or rework often associated with paste-based solutions.

Suitable for

• Gap filling between heatsinks and CPUs, GPUs or power modules
• Thermal interface on memory ICs, MOSFETs and SMD components
• Large or irregular PCB surfaces in laptops, gaming consoles and compact systems

Key specifications

• Dimensions: 120 × 120 × 0.5 mm
• Material type: thermal interface pad (non-liquid)
• Density: 2.8 g/cm³
• Electrical properties: non-electrically conductive
• Chemical/physical behavior: non-corrosive, non-curing, non-toxic
• Package: single pad per pack

How to use

Before application, power down the device and discharge any static. Clean both mating surfaces to remove dust, grease and old thermal material using isopropyl alcohol and a lint-free cloth. Measure and cut the thermal pad to the required shape if necessary, then remove the protective liner and place the pad onto the component or heatsink ensuring full contact. Apply even pressure when reassembling the cooler to seat the pad and establish thermal contact. Verify clearance and mounting force to avoid excessive compression beyond intended thickness.

Usage recommendations

Use the GP-Extreme pad where a stable, non-liquid thermal interface is preferred: for gap filling on large PCBs, between heatsinks and components with height variation, and in applications where electrical insulation is required. Avoid using the pad in places where direct soldering or electrically conductive adhesives are necessary. Store the pad in a cool, dry place away from direct sunlight and contaminants to preserve handling properties.