Thermal pad Gelid Extreme TP-GP01-S-F 120×120×2.5 mm for heat transfer between components

Thermal pad Gelid Extreme TP-GP01-S-F 120×120×2.5 mm provides a thermally conductive interface material designed to improve heat transfer between electronic components and heatsinks. The pad fills air gaps and compensates for surface irregularities to ensure stable thermal contact on PC components such as GPUs, VRAM modules and power electronics. Its 120×120×2.5 mm dimensions make it suitable for medium to large contact areas where consistent conduction and reliable gap filling are required.

Advantages

The thermal pad offers a balance of softness and thermal conductivity to conform to uneven surfaces while maintaining mechanical stability. It reduces thermal resistance between components and cooling solutions without the need for liquid compounds, remains electrically non-conductive, and is designed for straightforward placement and replacement. Its uniform thickness helps preserve even pressure distribution across the contact area and supports long-term thermal performance under typical operating conditions.

Suitable for

• Thermal coupling between GPUs and aftermarket or stock heatsinks
• Cooling VRAM modules and memory chips on graphics cards and motherboards
• Thermal bridging in power electronics, MOSFETs and voltage regulation modules
• Filling gaps between PCBs and chassis or heatsink plates

Key specifications

• Dimensions: 120 × 120 × 2.5 mm
• Material type: thermally conductive silicone-like pad
• Function: gap filling and thermal interface for electronic components
• Electrical property: electrically non-conductive
• Application temperature range: suitable for typical electronic device operating temperatures

How to use

Clean both mating surfaces to remove dust, old thermal compound or grease and ensure dry, residue-free contact areas. Cut the thermal pad to the required shape and size if necessary, peel off any protective liners, and position the pad directly between the component and the heatsink. Apply steady pressure when assembling to ensure full contact and avoid trapping air pockets. Reassemble the device and verify that the heatsink mounting provides uniform compression across the pad.

Usage recommendations

Store unused portions in a sealed bag away from direct sunlight and extreme temperatures. Replace the pad if it shows permanent deformation, physical damage, or noticeably reduced thermal performance after extended use. When cutting or trimming, use a clean, sharp blade and measure carefully to maintain the intended thickness and contact area.