Thermal pad Gelid TP-GP03-A 7 W/mK 120×20×0.5 mm – thermal interface pad

Gelid TP-GP03-A is a thin, conformable thermal pad with a thermal conductivity of 7 W/mK and dimensions of 120×20×0.5 mm. Designed as a thermal interface material, it fills microscopic and small macroscopic gaps between heat-generating components and heatsinks, improving heat transfer without the need for messy pastes. Its low profile makes it suitable where clearance is limited and a reliable contact interface is required for steady thermal performance.

Advantages

The thermal pad provides consistent thermal conduction across irregular surfaces and maintains mechanical stability at a 0.5 mm thickness. With a thermal conductivity of 7 W/mK, it delivers improved heat dissipation compared to standard silicone pads. The material is easy to cut to size, non-flowing and non-curing, which simplifies installation and reduces maintenance over time.

Suitable for

• PC small components: chips, MOSFETs, voltage regulators
• Compact heatsinks and fins in tight enclosures
• LED modules and lighting fixtures requiring thin thermal interface
• Embedded systems and single-board computers with limited clearance

Key specifications

• Thermal conductivity: 7 W/mK
• Dimensions: 120 × 20 × 0.5 mm
• Material: thermally conductive elastomeric pad
• Physical form: thin, conformable sheet
• Surface compliance: conforms to micro- and small macro-scale surface irregularities

How to use

Measure the contact area and cut the pad to the required size with a sharp blade or scissors. Clean both mating surfaces from dust, grease and oxidation to ensure good thermal contact. Remove any protective liners, position the pad between the component and heatsink, and apply even pressure to ensure full surface contact. Ensure that the pad thickness and compression are compatible with the available gap to avoid excessive mechanical stress on components.

Usage recommendations

For best results, use at moderate compression specified by the equipment manufacturer and avoid exposing the pad to solvents or prolonged temperatures beyond the component ratings. Replace the pad if it becomes damaged or loses elasticity after repeated thermal cycles.