Thermal pad Gelid Ultimate 90×50×0.5 mm TP-GP04-A for heat conduction between components

Gelid Ultimate 90×50×0.5 mm TP-GP04-A is a thermally conductive pad designed to improve heat transfer between electronic components and heatsinks. Manufactured for use with CPUs, GPUs, VRMs, memory modules and other hot spots on PCBs and add-on cards, this grey thermal pad fills gaps and compensates for uneven surfaces to establish reliable thermal contact while providing electrical insulation. The sheet measures 90×50×0.5 mm and is suitable for compact and densely packed electronic assemblies where consistent thermal conduction and easy application are required.

Advantages

The GP-Ultimate pad features an enhanced multilayer matrix and a material composition that delivers high thermal conductivity while remaining non-electrically conductive, non-corrosive, non-curing and non-toxic. It supports an extended operating temperature range and is easy to cut and place, allowing precise fitting for irregular heights and tight spaces on PCBs. Its stable properties ensure long-term gap filling and improved heat dissipation compared with air gaps or poorly matched interfaces.

Suitable for

• Heat conduction between heatsinks and power MOSFETs, chipsets or voltage regulators (VRMs)
• Thermal interface on GPU cards and large PCB surfaces
• Cooling support for memory modules and SMD components with uneven heights
• Aftermarket cooling solutions and compact PC builds requiring precise gap filling

Key specifications

• Dimensions: 90 × 50 × 0.5 mm
• Colour: Grey
• Material properties: multilayer thermally conductive matrix
• Electrical behaviour: non-electrically conductive
• Chemical/physical stability: non-corrosive, non-curing, non-toxic
• Operating temperature range: -60 °C to 220 °C

How to use

Measure the gap and cut the thermal pad to the required shape and size with a sharp blade or scissors. Clean the contact surfaces on the PCB, components and heatsink from dust, grease and residues before application. Place the pad so it covers the heat-generating components and aligns with the heatsink contact area; apply gentle pressure to ensure full contact and eliminate trapped air. Reassemble the cooling solution and verify contact alignment; if necessary, slightly reposition or replace the pad to achieve optimal coverage and conduction.

Usage recommendations

Use the Gelid Ultimate pad where electrical insulation is required alongside efficient heat transfer. Avoid stretching the pad during cutting or installation and replace it if it becomes contaminated, deformed or compressed beyond functional thickness. For best results, pair the pad with clean heatsinks and firm mechanical mounting to maintain consistent pressure and long-term thermal performance.