Thermal pad Gelid Ultimate TP-GP04-B 90×50×1 mm — Gelid thermal interface material

Gelid Ultimate TP-GP04-B thermal pad (90×50×1 mm) is a thermal interface material engineered to improve heat transfer between electronic components and heatsinks. Designed for bridging height differences and uneven surfaces on PCBs, this 1 mm pad fills gaps between components such as power MOSFETs, chipsets, memory modules and other surface-mounted devices to ensure consistent contact and efficient thermal conduction in desktop and small-form-factor cooling systems.

Advantages

The Gelid Ultimate thermal pad uses a multilayer matrix and a proprietary material composition to deliver high thermal conductivity while remaining non-electrically conductive, non-corrosive, non-curing and non-toxic. Its stable 1 mm thickness provides controlled gap filling, the material supports a wide operating temperature range from −60°C to 220°C, and the supple pad simplifies placement and mounting on large PCB surfaces such as GPU cards, motherboards and add-on cards.

Suitable for

• Bridging uneven surfaces between heatsinks and high-temperature SMD components
• Thermal conduction for CPUs, GPUs and VRMs in desktop and small-form-factor systems
• Cooling solutions on GPU cards, motherboards and densely packed electronic boards
• Replacement or upgrade of existing gap fillers in electronics cooling assemblies

Key specifications

• Dimensions: 90 × 50 × 1 mm
• Material type: thermal interface pad with enhanced multilayer matrix
• Thermal behaviour: high thermal conductivity (specified as Ultimate class by manufacturer)
• Electrical property: non-electrically conductive
• Chemical/physical stability: non-corrosive, non-curing, non-toxic
• Operating temperature range: −60°C to 220°C
• Density (manufacturer data): 3.2 g/cm³

How to use

Measure and cut the Gelid Ultimate thermal pad to match the contact area on the PCB or heatsink, ensuring it covers the component and the corresponding heatsink surface without obstructing nearby parts. Remove any protective liners, align the pad carefully and apply even pressure to establish full contact between surfaces. Do not stretch the pad; trim to fit as needed. For best results, clean mating surfaces of dust, grease and previous thermal materials before installation.

Usage recommendations

Use the thermal pad where a stable 1 mm gap filler is required and electrical insulation is necessary. Avoid placing the pad across contacts that require electrical connectivity. For optimal thermal performance, ensure full surface contact and avoid compression beyond intended thickness; check component clearances and mounting hardware to prevent undue deformation.