Thermal pad Gelid TP-GP04-R-A 120×20×0.5 mm, density 3.2 g/cm³, grey

The GP-Ultimate 120×20 thermal pad from Gelid Solutions is a grey, non-electrically conductive interface material sized 120×20 mm and available in multiple thickness variants (0.5, 1.0, 1.5, 2.0 and 3.0 mm). It is formulated with an enhanced multilayer matrix to provide stable contact between heatsinks and uneven electronic surfaces such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs and other high-temperature SMD components. The pad is non-corrosive, non-curing, non-toxic and supports an extended operating temperature range from -60°C to 220°C.

Advantages

The GP-Ultimate 120×20 offers high thermal conductivity (15 W/mK) for efficient heat transfer, a soft compliant structure to fill gaps on uneven surfaces, and multiple thickness and packaging options (single pack and value pack). Its formulation ensures electrical insulation and long-term stability without curing or corrosion, suitable for densely packed electronic assemblies.

Suitable for

• Thermal bridging between RAM modules and heatsinks
• Cooling VRM and MOSFET circuits on motherboards and GPUs
• Thermal contact for M.2 SSDs and compact storage modules
• Insulating and heat-transfer interface for high-temperature SMD components

Key specifications

• Dimensions: 120 × 20 mm
• Available thicknesses: 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 3.0 mm
• Thermal conductivity: 15 W/mK
• Operating temperature range: -60°C to 220°C
• Electrical property: non-electrically conductive
• Other: non-corrosive, non-curing, non-toxic; colour: grey

How to use

Cut the thermal pad to the required size if necessary, remove the protective film(s), and place it between the heat-generating component and the heatsink or metal surface, ensuring full contact across the surface. Reassemble the device and apply appropriate fastening pressure so the pad compresses to fill height differences and surface irregularities. For best results, use a pad thickness that closely matches the gap you need to bridge.

Usage recommendations

Choose the thickness variant that matches the gap between component and heatsink; test fit before final assembly. Avoid stretching the pad during installation and ensure surfaces are clean and free of dust or thermal paste residues for optimal thermal transfer.