Thermal pad Gelid GP-Ultimate 120×120×0.5 mm TP-GP04-S-A for heat transfer between components

Gelid GP-Ultimate thermal pad TP-GP04-S-A (120×120×0.5 mm) is a pre-cut thermal interface material engineered to improve heat transfer between electronic components and heatsinks. With a large contact area and a 0.5 mm thickness, this thermal pad fills small gaps and accommodates uneven surfaces on PC components such as DRAM ICs, VRM circuits, power MOSFETs and M.2 SSDs. The material is non-electrically conductive, non-corrosive, non-curing and non-toxic, and it supports an extended operating temperature range from -60°C to 220°C.

Advantages

The GP-Ultimate 120×120 thermal pad offers high thermal conductivity (advertised at 15 W/mK) to improve heat transfer to heatsinks and metal contact surfaces. Its multilayer matrix and uniform composition provide consistent thermal contact across enlarged surfaces while remaining electrically insulating. The pad’s non-curing, stable formulation allows repositioning during installation and long-term use without degradation under the stated temperature range.

Suitable for

• Cooling RAM modules and DRAM ICs
• VRM circuits and power delivery components on motherboards
• Thermal bridging for M.2 type SSDs and other compact storage modules
• Heat transfer between SMD power components (MOSFETs, regulators) and heatsinks

Key specifications

• Dimensions: 120 × 120 × 0.5 mm
• Thermal conductivity: 15 W/mK (manufacturer specification)
• Material properties: non-electrically conductive, non-corrosive, non-curing, non-toxic
• Operating temperature range: -60°C to 220°C
• Density (manufacturer indication): 3.2 g/cm³

How to use

Clean contact surfaces thoroughly to remove dust, grease and old thermal residues before applying the pad. Cut the 120×120 sheet if necessary to match the component area, peel off the protective film and place the pad so it fully covers the heat-generating element and makes firm contact with the heatsink or metal plate. Apply even pressure to ensure full surface contact and avoid trapped air pockets. Reassemble the device and verify mechanical clearance and mounting pressure to ensure reliable thermal contact.

Usage recommendations

Use the thermal pad where a thin, electrically insulating gap-filler is required and where surfaces are slightly uneven or have height differences. For optimal results, select pad thickness and cut shapes that match component geometry, verify compatibility with surrounding components, and avoid stretching or compressing the pad beyond its intended thickness during installation.