Thermal Pad Gelid 120 x 20 x 1.5 mm TP-GP05-C – thermal interface material for heat transfer

Gelid Thermal Pad TP-GP05-C is a pre-cut thermal interface material sized 120 x 20 x 1.5 mm that provides a compliant, non-liquid solution for heat transfer between electronic components and heatsinks. The pad is intended to fill gaps and improve thermal contact on CPUs, GPUs, power modules and other components where a consistent, durable interface is required. Its 1.5 mm thickness makes it suitable for applications with moderate spacing while remaining easy to handle and position during installation.

Advantages

This thermal pad offers predictable thermal performance without the mess of pastes or liquids. It is cut to size for quick placement and provides gap-filling compliance to accommodate uneven surfaces and mounting tolerances. The solid form reduces risk of flow or migration compared with liquid thermal compounds, and the pad remains stable over time under normal operating conditions.

Suitable for

• Replacing worn or damaged thermal pads on cooling assemblies
• New builds where a non-liquid, easy-to-install interface is preferred
• Thermal bridging between heatsinks and electronic components such as CPUs, GPUs and power modules
• Applications requiring gap filling and mechanical compliance

Key specifications

• Dimensions: 120 x 20 x 1.5 mm
• Form: pre-cut thermal pad (solid, non-liquid)
• Function: gap-filling thermal interface material
• Compatibility: suitable for CPUs, GPUs, power modules and similar electronic components

How to use

Before installation, power down the system and disconnect any power sources. Clean mating surfaces thoroughly to remove dust, old thermal compound or adhesive residues using isopropyl alcohol and a lint-free cloth. Peel protective liners from both sides of the thermal pad as needed, position the pad on the component or heatsink, and apply even pressure to ensure full contact without trapping air. Reassemble the cooling assembly and restore power. Verify temperatures under load to confirm correct thermal contact.

Usage recommendations

Use this thermal pad where a stable, non-fluid interface is required and where the 1.5 mm thickness provides adequate contact. For best results, ensure surfaces are clean and flat; avoid stretching or compressing the pad excessively during placement. If a different gap thickness is present, choose a pad with the appropriate thickness rather than layering pads, to maintain consistent thermal conductivity and mechanical performance.