Thermal pad Gelid Ultimate TP-GP05-D 120×20×2.0 mm thermal interface pad

Gelid Ultimate TP-GP05-D 120×20×2.0 mm thermal interface pad is a compliant thermal pad designed to fill gaps between heat-generating components and heatsinks in PCs and electronic devices. With a 2.0 mm thickness and a rectangular format, the pad provides a consistent conductive layer that improves heat transfer where traditional thermal paste or imperfect contact surfaces are insufficient. It is suitable for bridging uneven surfaces and maintaining reliable thermal contact under light mechanical tolerance variations.

Advantages

The thermal pad offers a ready-to-apply solution that eliminates the need for messy pastes and simplifies component-to-heatsink installation. Its form factor and compressibility reduce thermal resistance across small air gaps, while the material maintains stable mechanical compliance over time. The pad's size and thickness are chosen to accommodate common mounting clearances, enabling efficient heat conduction for chips and power components without modifying the heatsink or PCB layout.

Suitable for

• Thermal bridging between CPUs, GPUs, and aftermarket heatsinks in compact builds
• Cooling VRMs, MOSFETs, and power regulation modules on motherboards
• Filling gaps in SFF (small form factor) systems and custom cooling assemblies
• Electronics repair and upgrades where surface unevenness prevents direct metal-to-metal contact

Key specifications

• Dimensions: 120 × 20 × 2.0 mm
• Material type: compliant thermal interface pad (gel-based)
• Thermal conduction: designed to reduce thermal resistance between component and heatsink
• Compression behavior: conforms to uneven surfaces to maintain contact
• Application type: gap-filling thermal interface for PC and electronics cooling

How to use

Clean mating surfaces to remove dust, grease or old thermal compound before application. Cut the pad to the required shape and size if necessary, peel off protective liners, and position the pad directly onto the component or heatsink. Reassemble the heatsink or mounting hardware and apply uniform pressure to ensure the pad compresses and conforms to both surfaces. No curing time is required; the pad provides immediate thermal contact once compressed.

Usage recommendations

Ensure the pad thickness (2.0 mm) matches the gap to be filled; excessive compression can reduce effectiveness while insufficient compression may leave air pockets. Avoid stretching the pad when cutting or handling, and replace the pad if removed and reinstalled multiple times to maintain optimal thermal performance.