Thermal pad Gelid Gelid Extreme TP-GP05-F 120×20×2.5 mm

Gelid Extreme TP-GP05-F is a 120×20×2.5 mm thermal pad designed to improve heat transfer between electronic components and heatsinks. This ready-to-use, gap-filling interface offers a uniform contact surface for chips, modules and compact heatsinks, helping to reduce thermal resistance and stabilise operating temperatures in PCs and other electronic assemblies.

Advantages

The thermal pad provides consistent thickness and elasticity to accommodate uneven surfaces and small gaps, ensuring reliable thermal contact without the need for messy pastes. Its pre-cut dimensions make installation fast and repeatable while the material properties maintain conformity under typical operating conditions. The pad is non-liquid, minimises the risk of spillage and simplifies replacement or upgrades of existing thermal interfaces.

Suitable for

• Thermal interface between chips (e.g. VRM, MOSFETs) and small heatsinks
• Cooling modules and memory components in desktop and compact PCs
• Electronics assemblies where a defined 2.5 mm gap needs filling
• Maintenance or replacement of worn or degraded thermal pads

Key specifications

• Dimensions: 120 × 20 × 2.5 mm
• Form: solid thermal pad, flexible and gap-filling
• Application: pre-formed pad for direct placement between component and heatsink
• Performance: engineered for improved thermal conduction compared to air gaps
• Compatibility: suitable for use with PC components and compact electronic assemblies

How to use

Ensure both component and heatsink contact surfaces are clean, dry and free of debris. Measure and, if necessary, trim the pad to fit the target area while preserving full coverage of the heat-generating surface. Remove protective film and place the pad directly onto the component, then mount the heatsink to establish firm, even contact. Avoid twisting or stretching the pad during installation and confirm alignment before final fastening.

Usage recommendations

For optimal results, check thermal contact and temperatures after initial operation and re-seat the heatsink if necessary. Replace the pad if it shows signs of compression set or physical degradation. Use pads of appropriate thickness when targeting different gap heights and follow manufacturer guidance for component cooling requirements.