Thermal pad Gelid Ultimate TP-VP04-E 90×50×3 mm — 2 pcs

Gelid Ultimate TP-VP04-E thermal pad comes as two pre-cut pieces sized 90×50×3 mm, engineered for reliable gap filling between heat-generating components and heatsinks or spreaders. The pad’s 3 mm thickness offers compressible thermal interface material suited for larger clearances and uneven surfaces, enabling stable thermal contact without liquid thermal compounds. It is intended for use in PCs, servers and other electronic assemblies where a durable, non-curing interface is preferred to improve heat transfer while simplifying installation.

Advantages

The thermal pad provides consistent contact over irregular surfaces and preserves mechanical separation between components and coolers. Its preset dimensions reduce trimming and fitting time, and the compressible material accommodates tolerances and slight component height differences. Being non-liquid and non-curing, the pad maintains performance over time without spreading or hardening, which simplifies maintenance and replacement.

Suitable for

• Filling gaps between CPU/GPU modules and heatsinks where a 3 mm thickness is required
• Thermal interface for VRM, memory modules, power regulators and chipset coolers
• Electronics assemblies in servers and workstations with uneven contact surfaces

Key specifications

• Dimensions per piece: 90 × 50 × 3 mm
• Quantity: 2 pieces
• Compressible thermal interface material designed for gap filling
• Non-liquid, non-curing composition for stable long-term use
• Easy to cut and fit to custom layouts

How to use

Clean both mating surfaces to remove dust, grease and old thermal materials. Measure the required area and, if necessary, trim the pad to match component dimensions using a sharp blade or scissors. Peel off any protective liners and place the pad on the cooler or component, ensuring full coverage of the contact area. Assemble the cooling solution and apply even pressure to compress the pad and create thermal contact. Check alignment and mounting pressure after initial thermal cycling.

Usage recommendations

Use the pad where a consistent gap-filling thermal interface is needed and where non-liquid material is preferred. Avoid exposing the pad to solvents or temperatures beyond the manufacturer’s operating range. For critical high-performance applications, confirm contact pressure and monitor component temperatures after installation to ensure adequate thermal transfer.