Thermal pad Gelid GP-Ultimate 120×20×0.5 mm, set of 2 (TP-VP04-R-A)

Gelid GP-Ultimate thermal pad set, two pieces sized 120×20×0.5 mm each, is a thin compliant thermal interface material engineered to transfer heat from electronic components to heatsinks while providing electrical insulation. The pre-cut grey pads fill gaps and accommodate surface irregularities on DRAM modules, VRM circuits, power MOSFETs, M.2 SSDs and other densely packed SMD components where a low-profile thermal interface is required.

Advantages

The GP-Ultimate pads feature a high thermal conductivity of 15 W/mK and a multilayer matrix that improves heat flow across uneven contact surfaces. They are non-electrically conductive, non-corrosive, non-curing and non-toxic, ensuring safe use near sensitive circuitry. With an operating temperature range from -60°C to 220°C, the material remains stable under wide temperature variations. The pre-cut 120×20 mm size and thin 0.5 mm thickness simplify installation on narrow or elongated components.

Suitable for

• Thermal bridging between RAM module chips and aftermarket heatsinks
• Cooling VRM and MOSFET power stages on motherboards and graphics cards
• Thermal interface for M.2 type SSDs and compact storage modules
• Heat transfer on densely packed SMD components and NVRAM ICs

Key specifications

• Dimensions: 120 × 20 × 0.5 mm (each pad)
• Set quantity: 2 pads
• Thermal conductivity: 15 W/mK
• Material properties: non-electrically conductive, non-corrosive, non-curing, non-toxic
• Operating temperature range: -60°C to 220°C
• Colour: grey
• Density (typical): 3.2 g/cm³

How to use

Clean both component and heatsink contact surfaces with isopropyl alcohol and ensure they are dry and free of debris. Peel protective liners from both sides of the pad, align the pad over the component so it covers the active area without obstructing connectors or mounting hardware, and press gently to conform the pad to the surfaces. Reassemble the cooling solution and apply uniform fastening pressure to ensure consistent contact between component, pad and heatsink. If trimming is required for a precise fit, use a sharp blade and cut carefully to the required size before removing protective liners.

Usage recommendations

For optimal thermal transfer, avoid stretching the pad during placement and ensure there is no trapped dust or adhesive residue on mating surfaces. Use the 0.5 mm thickness on applications that require a low-profile interface; choose thicker variants of the GP-Ultimate family when larger gaps need filling. Store unused pads in a cool, dry place away from direct sunlight.