Thermal Pads Gelid Ultimate 120×20×3.0 mm — 2 pack

Gelid Ultimate thermal pads, supplied as a 2-pack with each pad measuring 120×20×3.0 mm, provide a conformable thermal interface for filling gaps between heat-generating components and heatsinks. These pads are intended to improve heat transfer where precise mating surfaces are not available, offering easier installation than liquid thermal compounds and a reusable, non-adhesive option compared to thermal tapes. The product is suitable for PC cooling applications, LED modules, power electronics and other assemblies that require dependable thermal conduction across small to medium air gaps.

Advantages

Gelid Ultimate thermal pads combine softness and thermal conductivity to conform to uneven surfaces while maintaining mechanical stability. Their fixed thickness of 3.0 mm simplifies gap-filling without the need for shims or repeated application, and the non-liquid form reduces the risk of spillage or contamination. Supplied as a two-piece set, the pads allow replacement or simultaneous use on multiple components.

Suitable for

• CPU and chipset cooling in desktop and small form-factor PCs
• GPU or VRM gap filling where heatsink contact is imperfect
• LED modules and light engines requiring heat conduction to heat sinks
• Power supply and power electronics assemblies with thermal interface needs
• Embedded systems and industrial boards with non-uniform component heights

Key specifications

• Quantity: 2 pads per package
• Dimensions per pad: 120 × 20 × 3.0 mm
• Form factor: solid thermal pad, conformable gel material
• Application type: gap filling thermal interface material
• Compatibility: suitable for metal heatsinks and electronic components

How to use

Clean and dry the surfaces of both the heatsink and the component before applying the pad to ensure optimal thermal contact. Cut the pad to the required shape and size if necessary, remove any protective liners, and press the pad firmly into place to conform to surface irregularities. Reassemble the device ensuring even pressure on the heatsink so the pad maintains continuous contact with both surfaces. If pads are removed, inspect them for deformation or contamination and replace as needed.

Usage recommendations

Store pads in a dry, dust-free environment and avoid stretching or compressing them excessively during installation. For long-term reliability, verify thermal performance after initial operation and replace pads that show visible wear, permanent deformation, or reduced heat transfer.