Thermal pad Gelid Extreme 120×20×2.0 mm, 2 pcs — Gelid TP-VP05-D

Gelid Extreme thermal pad set TP-VP05-D includes two pre-cut pads sized 120×20×2.0 mm designed to act as a thermal interface between electronic components and heatsinks. With a uniform 2.0 mm thickness and compliant silicone-like material, these pads bridge air gaps and irregular surfaces to enable more consistent heat conduction where a reliable, non-liquid interface is required.

Advantages

These thermal pads provide stable contact pressure and a predictable thermal path without the mess of paste. Their pre-cut rectangular shape and consistent thickness simplify installation and reduce the need for trimming. The pads are electrically insulating while thermally conductive, minimizing risk of short circuits during placement. Two pieces in the set allow matching multiple contact points or keeping a spare pad for maintenance.

Suitable for

• Bridging gaps between chips (ICs) or MOSFETs and heatsinks
• Thermal coupling in PC and server cooling assemblies
• Use in electronic modules, power supplies, or control boards requiring a preformed thermal interface

Key specifications

• Dimensions: 120 × 20 × 2.0 mm (per pad)
• Quantity: 2 pads per set
• Solid thickness: 2.0 mm for gap filling
• Form factor: pre-cut rectangular pads for easy placement
• Material type: compliant thermally conductive pad (non-liquid)

How to use

Clean the contact surfaces of any dust, thermal paste residue, or oils before applying the pad. Remove protective liners from both sides of the pad and align it directly over the component or heatsink contact area. Press gently to establish full surface contact and ensure the pad conforms to the surfaces under normal mounting pressure. If necessary, trim the pad carefully to match the target footprint using a sharp blade or scissors, taking care to maintain even edges.

Usage recommendations

Use these pads where a fixed-thickness, non-liquid thermal interface is preferred. Verify that the 2.0 mm thickness matches the gap to be bridged and ensure mounting pressure is sufficient for full contact. Avoid stretching the pad during installation and replace pads during major hardware servicing to maintain optimal thermal performance.