Heat Sink Compound Gembird TG-G1.5-01

The Gembird TG-G1.5-01 heat sink compound is a grey thermal grease formulated to improve heat transfer between CPUs, chipsets, processors and their heatsinks. Supplied in a 1.5 g package, it features thermal conductivity of 4.5 W/m·K and a viscosity of 76 CPS, making it suitable for filling microscopic gaps and improving cooling efficiency in electronic assemblies without conducting electricity.

Advantages

This thermal compound provides excellent thermal impedance and stable performance across its operating range (-50 to 240 °C). It remains stable over time and will not separate, run, migrate or bleed. The non-capacitive and non-electrically conductive formula reduces the risk of electrical shorts while ensuring consistent heat dissipation.

Suitable for

• Applying between CPUs or GPUs and heatsinks
• Thermal interface material for chipsets and processors
• Small electronics and hobbyist cooling upgrades

Key specifications

• Thermal conductivity: 4.5 W/m·K
• Package weight: 1.5 g
• Viscosity: 76 CPS
• Operating temperature range: -50 to 240 °C
• Colour: Grey
• Brand: GEMBIRD, MPN: TG-G1.5-01, EAN: 8716309083126

How to use

Clean both contact surfaces thoroughly to remove old paste, dust and oils. Apply a small, pea-sized amount of the Gembird TG-G1.5-01 compound to the center of the CPU or component, then mount the heatsink and secure it according to the device manufacturer’s instructions. The compound spreads under pressure to fill micro-gaps and ensure thermal contact; avoid applying excessive amounts as this can reduce cooling performance.

Usage recommendations

For best results, store the product in a cool, dry place and use within the manufacturer’s suggested shelf life. Use the compound on components that require a non-conductive thermal interface and avoid contact with exposed electrical contacts or sockets.