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Product specification Gembird TG-G15-02 heat sink compound Thermal paste 4.63 W/m·K 15 g
Features
Packaging data
Package weight:
11870 g
Package depth:
350 mm
Package height:
345 mm
Package width:
490 mm
Quantity per pack:
400 pc(s)
Features
Type:
Thermal paste
Certification:
RoHS, CE
Operating temperature (T-T):
-30 - 280
Product colour:
Grey
Thermal resistance:
0.0087 °C/W
Viscosity note:
12500 Pa s
Thermal conductivity:
4.63 W/m·K
Constitutive ingredients:
Silicone
Density:
3.15 g/cm³
Carbon percentage:
35 %
Silicone percentage:
15 %
Weight & dimensions
Weight:
0.015 kg
Height:
30 mm
Width:
30 mm
Depth:
35 mm
Logistics data
Country of origin:
China
Description
Advantages
- - Thermal silicone compound (grease) for heatsinks
- - Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- - Excellent thermal impedance
- - Perfect stability - will not separate, run, migrate, or bleed
- - Non capacitive or electrically conductive
Heatsink silicone thermal paste grease, 15 g
Keep your computer's CPU cool
Practical bottle of increased volume
