Thermal adhesive (heat sink compound) GrauGear G-TMP-13W — 12.8 W/m·K, grey, 45×100×1 mm

GrauGear G-TMP-13W is a grey thermal adhesive film designed to bond heat sinks to electronic components while providing effective thermal transfer. The product is supplied as a thin, pre-cut sheet measuring 45 × 100 × 1 mm and combines mechanical adhesion with a thermal conductivity of 12.8 W/m·K to improve heat dissipation between mating surfaces.

Advantages

The thermal adhesive film provides both adhesive fixation and a conductive thermal path, reducing the need for mechanical fasteners in compact assemblies. Its 1 mm thickness creates a consistent interface layer that compensates for minor surface irregularities and helps maintain stable thermal contact. Delivered as a ready-to-use sheet, it simplifies application and reduces handling time compared with liquid adhesives or pastes.

Suitable for

• Bonding small to medium heat sinks to semiconductors, power ICs and modules
• Thermal interface in LED modules and lighting assemblies
• Securing thermal pads in compact electronic enclosures
• Applications requiring both mechanical fixation and thermal conduction

Key specifications

• Thermal conductivity: 12.8 W/m·K
• Color: grey
• Sheet dimensions: 45 × 100 × 1 mm
• Form factor: thin adhesive film / pre-cut sheet
• Pack quantity: 1 piece per pack

How to use

Ensure both bonding surfaces are clean, dry and free of grease or dust. Measure and, if necessary, trim the sheet to match the heat sink or component contact area. Peel off any protective liners, align the film with the surfaces, and press firmly to establish full contact. Apply uniform pressure across the joint to optimize adhesion and thermal conduction. Allow any adhesive bond to set as specified by the assembly conditions before subjecting the device to mechanical stress or thermal cycling.

Usage recommendations

For best thermal performance, use on flat, smooth surfaces and avoid trapping contaminants between the film and mating parts. In high-vibration environments consider additional mechanical support. Verify compatibility with component operating temperatures and assembly processes before large-scale use.