Thermal pad Iceberg DRIFTIce 13 W/m·K, grey, 40×80×2 mm

Iceberg DRIFTIce thermal pad provides a reliable thermal interface material with a thermal conductivity of 13 W/m·K. The grey pad measures 40×80×2 mm and is supplied as a single piece per pack. Designed to improve heat transfer between electronic components and heatsinks, this pad is suitable for filling small gaps and improving contact on cooling modules, power devices and compact PC components.

Advantages

The DRIFTIce thermal pad combines high thermal conductivity and dimensional stability to facilitate efficient heat transfer. Its 2 mm thickness and flexible composition enable even contact over uneven surfaces without the need for curing. Supplied as a single piece, the pad is easy to cut to size for precise placement and remains flexible over prolonged use.

Suitable for

• Filling air gaps between heatsinks and electronic components
• Thermal interface for VGA cards and GPU cooling modules
• Heat dissipation for RAM modules and small PC components
• Thermal management in power devices and compact electronics

Key specifications

• Thermal conductivity: 13 W/m·K
• Color: grey
• Dimensions (L×W×T): 40×80×2 mm
• Form: single-piece pad suitable for cutting
• Material behavior: flexible, designed to maintain flexibility over time

How to use

Clean both contact surfaces to remove dust, grease or old thermal material before applying the pad. Measure and cut the pad to match the contact area, accounting for any mounting tolerances. Remove protective liners if present and position the pad between the component and heatsink, then assemble the parts ensuring uniform pressure to achieve even contact and optimal heat transfer.

Usage recommendations

For best results, use a pad thickness that matches the gap to avoid excessive compression or poor contact. When cutting the pad, use a sharp blade and a straight edge for precise dimensions. Avoid stretching the material during installation and inspect contact after initial operation to confirm proper seating.