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Thermal paste Iceberg Thermal FUZEIce
Iceberg Thermal FUZEIce is a high-performance thermal paste formulated to improve heat transfer between CPUs, GPUs and other heat-generating components. With a thermal conductivity of 11.25 W/m·K and a density of 2.6 g/cm³, this 7 g syringe delivers efficient thermal coupling and is suitable for systems that require consistent cooling and long-term stability.
The paste offers low application temperature combined with high thermal conductivity for efficient heat dissipation and support for higher clock speeds. A precision applicator and angled spreader are included to simplify application and reduce mess. FUZEIce is rated for operating temperatures up to 200°C and is formulated for long-term use.
Clean the contact surfaces thoroughly with isopropyl alcohol and a lint-free cloth before applying. Dispense a small, pea-sized amount of FUZEIce onto the centre of the CPU or heat spreader, then use the included angled spreader to evenly distribute a thin layer across the surface. Reassemble the cooler according to the manufacturer's instructions and run the system to seat the cooler and check temperatures.
Apply a minimal, even layer for the best thermal transfer; avoid over-application. Replace the paste when removing the cooler for maintenance or if thermal performance degrades. FUZEIce is suitable for both air and liquid cooling setups.
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