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Thermal pad Iceberg Thermal DRIFTIce
The Iceberg Thermal DRIFTIce thermal pad is a grey gap-filling pad measuring 40 mm x 80 mm x 1.5 mm designed for reliable thermal management of electronic components. With a thermal conductivity of 13 W/m·K and an operating temperature range from -40 °C to 200 °C, the DRIFTIce pad provides consistent contact for heat transfer in applications such as graphics cards, RAM modules and notebook components.
DRIFTIce delivers high thermal conductivity (13 W/m·K) in a flexible pad that remains pliable over time and resists hardening or corrosion. The pad is easy and precise to apply, allowing even contact across air gaps, and is available in multiple sizes and thicknesses so you can select the dimension that fits your needs.
Clean both contact surfaces to remove dust, oil or old thermal material. Cut the DRIFTIce pad to the required size if necessary, remove any protective liners, and place the pad so it fills the air gap between the heat source and heatsink. Reassemble the device ensuring even pressure to produce consistent contact and optimal heat transfer.
Use the pad thickness that matches your gap for best thermal contact; avoid excessive compression that could reduce effective coverage. The pad is intended for electronic component cooling—do not use on exposed electrical contacts or where conductive debris could cause short circuits.
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