InLine Thermal Compound 0.5g with Scoop

The InLine Thermal Compound 0.5g with Scoop is a specialized thermal paste designed to facilitate efficient heat transfer between computer processors and heatsinks. This compound helps maintain stable operating temperatures during intensive computing tasks by bridging microscopic gaps between the component and the cooling solution. Featuring a balanced formulation of silicone, carbon, and metal oxides, the paste ensures reliable thermal conductivity for standard PC builds and electronic repairs.

Advantages

Using this thermal compound helps prevent overheating by improving thermal coupling between heat-generating electronic components and heatsinks. The inclusion of a dedicated application scoop allows for precise and uniform spreading across the contact surface, minimizing waste and ensuring optimal coverage. The wide operating temperature range ensures stable performance under various thermal loads, while the compact volume is suited for single-application needs.

Suitable for

• Applying thermal paste on CPU and GPU processors during PC assembly
• Electronic repairs and maintenance of computer hardware
• IT service deployments in offices and educational institutions
• Improving heat dissipation in custom cooling setups

When it may not be suitable

This product may not be sufficient for extreme overclocking scenarios that require ultra-high thermal conductivity compounds. Additionally, the 0.5g quantity is designed for limited applications and is not practical for large-scale manufacturing or continuous workshop repairs.

Key specifications

• Thermal conductivity: > 1.729 W/m-K
• Thermal resistance: 0.125 °C-in²/W
• Operating temperature range: -50°C to 240°C
• Net content: 0.5g
• Composition: Silicone 50%, carbons 30%, metal-oxides 20%
• Color: White
• Included accessory: Application scoop

How to use

Ensure the contact surfaces of the processor and heatsink are completely clean and dry before application. Dispense a small amount of the InLine thermal compound onto the center of the processor. Use the provided scoop to spread the paste into a thin, even layer across the entire contact area. Mount the heatsink securely onto the processor immediately after spreading to ensure proper distribution and avoid air bubbles.

What to consider before purchase

• Verify that the 0.5g quantity is sufficient for your intended number of applications
• Check your processor and heatsink compatibility for standard thermal paste requirements
• Consider if your thermal load demands higher conductivity ratings than specified

For best results, store the thermal compound in a cool, dry place and clean old paste residue thoroughly with isopropyl alcohol before applying a fresh layer.