-
Lead plating:
-
Gold
-
Backlight:
Product has a built-in light source for its illuminating.
-
No
-
Cooling type:
The method used to cool the device or to cool the air around the device.
-
Heatsink
-
Memory type:
Type of memory in the device e.g. DDR3, SRAM (Static RAM).
-
PC3-12800
-
Product colour:
The colour e.g. red, blue, green, black, white.
-
Green
-
Module configuration:
-
512M x 64
-
Memory voltage:
The voltage (V) of the memory in the device.
-
1.35
-
Memory channels:
-
Single-channel
-
Buffered memory type:
-
Unregistered (unbuffered)
-
Memory bus:
Hardware and software that connects the main memory to the memory controller in computer systems. Originally, general-purpose buses like VMEbus and the S-100 bus were used, but to reduce latency, modern memory buses are designed to connect directly to DRAM chips, and thus are designed by chip standards bodies such as JEDEC.
-
64 bit
-
Memory clock speed:
The frequency at which the memory (e.g. RAM) runs.
-
1600 MHz
-
CAS latency:
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
-
11
-
ECC:
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
-
No
-
Memory form factor:
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
-
240-pin DIMM
-
Component for:
What this product is used as a part of (component for).
-
PC/Server
-
Internal memory type:
The type of internal memory such as RAM, GDDR5.
-
DDR3L
-
Memory layout (modules x size):
How the overall memory of the product is put together, defined by the number of modules and the size.
-
1 x 4
-
Internal memory:
A computer's memory which is directly accessible to the CPU.
-
4 GB
