Thermal paste Kolink UMBRA PRO TP-1 1.5g thermal compound for CPU/GPU cooling

Kolink UMBRA PRO TP-1 is a 1.5 g thermal compound supplied in a syringe-style tube for precise application between CPUs, GPUs and heatsinks. The paste forms a thin interface layer that fills microscopic gaps between component surfaces and the cooler, improving thermal conductivity and reducing operating temperatures in desktop and laptop systems. Its small volume is intended for single or occasional use during repairs, upgrades or custom builds where controlled placement and minimal excess are required.

Advantages

The thermal compound offers stable thermal transfer with a consistency suited to careful, even spreading or direct dot/line application from the syringe. Its formulation minimizes pump-out and drying under typical operating conditions, supporting sustained contact between the processor and cooler. The compact 1.5 g tube allows targeted use without large leftovers and is convenient for technicians and hobbyists working on individual systems.

Suitable for

• Desktop CPU and GPU cooling during installation or replacement of coolers
• Laptop repairs and thermal maintenance where small amounts are required
• Custom PC builds and component swaps requiring precise thermal interface application
• Situations demanding minimal waste and controlled, localized application

Key specifications

• Net volume: 1.5 g tube suitable for a few applications on standard processors
• Packaging: syringe-style applicator for accurate placement
• Consistency: paste designed for thin, even thermal interface layers
• Compatibility: intended for use between metal heatsinks and semiconductor surfaces (CPUs/GPUs)
• Operating range: formulated for typical consumer and workstation thermal conditions

How to use

Ensure both the processor and heatsink surfaces are clean and free of old thermal material, dust and oils. Apply a small, pea-sized dot or a thin line of thermal paste to the center of the CPU or GPU die area, or use a spread technique if preferred; the syringe applicator enables controlled dispensing. Mount the heatsink and apply even pressure to spread the compound into a thin, uniform layer between the mating surfaces. Reassemble the system and verify proper cooler seating and fan operation before powering on.

Usage recommendations

Use the 1.5 g quantity for one or a few installations; avoid applying excessive amounts as this can hinder heat transfer. For best results, follow component manufacturer torque and mounting guidelines and periodically inspect thermal interfaces during maintenance. Store the tube capped in a cool, dry place to preserve consistency.