Internal SSD Lenovo MIC 3400 1TB M.2 2280 PCIe Gen4

Lenovo MIC 3400 1TB M.2 2280 PCIe Gen4 is an internal solid-state drive offered in the compact M.2 2280 form factor. It uses the PCIe Gen4 interface to deliver higher sequential read and write throughput compared with previous generation PCIe devices. With 1TB capacity, the drive provides space for operating systems, applications and user data while reducing boot and load times in compatible desktops and workstations.

Advantages

The PCIe Gen4 interface enables faster data transfer rates and improved system responsiveness for supported platforms. The M.2 2280 form factor simplifies installation in standard M.2 slots without occupying 2.5" drive bays. A 1TB capacity balances storage space and cost for primary system drives or high-performance secondary storage. The drive design supports lower latency access and reduced application load times compared to mechanical drives.

Suitable for

• Upgrading desktop or workstation storage to reduce boot and application load times
• Installing operating systems and frequently used applications
• High-performance secondary storage for content creation and software development
• Compact builds that require an M.2 2280 SSD

Key specifications

• Form factor: M.2 2280
• Interface: PCIe Gen4 (NVMe protocol)
• Capacity: 1TB usable storage
• Intended use: internal SSD for desktops and workstations

How to use

Power down the computer and disconnect it from mains power before installation. Locate an available M.2 slot on the motherboard compatible with PCIe Gen4. Remove the mounting screw, insert the SSD at a slight angle into the M.2 socket, and secure it with the mounting screw. Reconnect power and start the system. Configure the drive in BIOS/UEFI if required, then initialize, partition and format the drive within the operating system or install the OS directly to the new SSD following standard installation procedures.

Usage recommendations

Ensure motherboard and processor support PCIe Gen4 to achieve maximum throughput. Use appropriate thermal management in compact systems, such as M.2 heatsinks or motherboard-provided thermal pads, when sustained high transfer workloads are expected.