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Weight:
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
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0.01 kg
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Internal memory type:
The type of internal memory such as RAM, GDDR5.
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DDR3
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Package weight:
Weight of the packaged product.
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20 g
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Number of pins:
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240
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Height:
The measurement of the product from head to foot or from base to top.
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30 mm
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ECC:
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
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Yes
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Module configuration:
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256M x 4
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Lead plating:
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Gold
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CAS latency:
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
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9
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Width:
The measurement or extent of something from side to side.
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140 mm
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Depth:
The distance from the front to the back of something.
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80 mm
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Product colour:
The colour e.g. red, blue, green, black, white.
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Green
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Memory clock speed:
The frequency at which the memory (e.g. RAM) runs.
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1333 MHz
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Package depth:
The distance from the front to the back of the packaging.
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80 mm
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Package height:
The distance from the top to the bottom of the packaging.
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30 mm
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Package width:
The distance from one side of the packaging to the other.
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140 mm
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Memory voltage:
The voltage (V) of the memory in the device.
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1.5
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Capacity:
Capacity of the storage media.
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2 GB
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Internal memory:
A computer's memory which is directly accessible to the CPU.
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2 GB
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Memory layout (modules x size):
How the overall memory of the product is put together, defined by the number of modules and the size.
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1 x 2
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Buffered memory type:
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Registered (buffered)
