Thermal Paste NATEC Husky Pup heat sink compound, thermal conductivity 4.63 W/m·K, -30–280°C, grey

Heat Sink Compound NATEC Husky Pup is a grey thermal paste formulated for efficient heat transfer between electronic components and cooling solutions. With a thermal conductivity of 4.63 W/m·K and an operating temperature range from -30 to 280 °C, the 0.5 g (0.2 ml) syringe provides a compact option for thermal management without curing time.

Advantages

The compound offers high thermal conductivity and low thermal resistance while remaining electrically non-conductive and non-corrosive. It delivers optimal thermal performance after the first thermal cycle and is supplied in a handy syringe for precise, repeatable application.

Suitable for

• Thermal interface between CPUs/GPUs and heatsinks in small-form-factor systems
• Cooling of power transistors, voltage regulators and other discrete components
• Repair and maintenance tasks where small-quantity, precise application is required

Key specifications

• Thermal conductivity: 4.63 W/m·K
• Operating temperature: -30 to 280 °C
• Weight: 0.5 g (0.0005 kg)
• Volume: 0.2 ml
• Colour: Grey
• Brand: NATEC, MPN: NPT-1580, EAN: 5901969425512

How to use

Clean mating surfaces to remove old paste, dust and oils. Apply a small, pea-sized amount of the Husky Pup compound to the centre of the component or spread a thin, even layer across the heatsink contact area as required. Mount the heatsink and secure according to the device manufacturer’s instructions. No curing time is needed; thermal performance is effective after the first thermal cycle.

Usage recommendations

For best results, use the smallest amount that fully fills micro-gaps between surfaces to avoid excess squeeze-out. Store the syringe in a cool, dry place and keep the cap closed to prevent contamination.