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Thermal paste Nedis COOLP101WT white, thermal conductivity 1.63 W/m·K, 5 g
Thermal paste Nedis COOLP101WT is a white heat-conductive compound supplied in a 5 g tube, formulated to improve thermal contact between processors, GPUs, power transistors and heatsinks. With a thermal conductivity of 1.63 W/m·K, the compound fills microscopic surface irregularities and replaces trapped air at the interface, enabling more efficient heat transfer in computer builds and electronics repairs. The compact tube dimensions allow controlled dosing and application in small areas.
The paste provides consistent thermal conduction thanks to its rated thermal conductivity of 1.63 W/m·K. Its white appearance helps visual application when placing a thin, even layer between a semiconductor package and its heatsink. Packaged in a 5 g tube, the material is convenient for targeted repairs or small-scale installations where precise application is required.
Before application, power off and unplug the device and allow components to cool. Clean contact surfaces of old thermal compound, dust and debris using isopropyl alcohol and a lint-free cloth. Apply a small, pea-sized amount of Nedis COOLP101WT to the center of the processor or component, then mount the heatsink and secure it following the manufacturer’s instructions; pressure and mount method will spread the paste into a thin, even layer. For small components or spot repairs, use a fine applicator or spread carefully to avoid excess that could migrate to surrounding circuitry.
Use only the amount necessary to form a thin, continuous interface layer; excess compound does not improve heat transfer. Avoid getting paste on exposed electrical contacts. Store the tube capped in a cool, dry place and keep out of reach of children. Follow safety guidance on the product label regarding skin or eye contact and ventilation during cleaning.
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