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Thermal paste Nedis COOLP101WT 1.63 W/m·K 5 g White
Nedis COOLP101WT thermal paste is a white, high‑conductivity compound designed to improve heat transfer between a heatsink and a CPU or GPU. With a thermal conductivity of 1.63 W/m·K and a 5 g package, the paste fills microscopic surface imperfections to reduce trapped air and increase the effectiveness of the cooling assembly.
The thermal paste provides reliable heat conduction and dissipation, helping maintain lower component temperatures under load. Its formulation and white colour make it easy to apply and inspect during installation. The paste remains effective across a wide operating temperature range from -30 °C to 300 °C.
Clean the heatsink and processor contact surfaces from old compound and contaminants, then apply a small, even amount of the Nedis thermal paste to the centre of the processor die or heatsink contact area. Mount the heatsink and secure it according to the manufacturer’s instructions so the paste spreads into a thin, continuous layer ensuring optimal thermal contact.
Use sparingly—excess paste can reduce effectiveness. Reapply when replacing cooling components or if thermal performance degrades; store the product in a cool, dry place.
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