Thermal paste Nedis COOLP400SI

The Nedis COOLP400SI thermal paste provides high thermal conductivity (4.63 W/m·K) to improve heat transfer between a heatsink and CPU or GPU. The silver-coloured paste fills microscopic surface imperfections on contact surfaces, reducing trapped air and restoring the heatsink's effectiveness. Supplied in an 8 g tube, it is suitable for common consumer and professional cooling maintenance tasks.

Advantages

The compound delivers efficient heat conduction and dissipation, helping to prevent motherboard and processor overheating under heavy load. Its silver colour and measured thermal conductivity make application results predictable, and the small 8 g package is convenient for single or occasional use.

Suitable for

• Applying between CPU or GPU and heatsink
• Refurbishing or maintaining desktop PC cooling systems
• Small-scale electronics cooling where improved thermal contact is required

Key specifications

• Brand: Nedis
• Model: COOLP400SI
• Thermal conductivity: 4.63 W/m·K
• Operating temperature range: -30 °C to 280 °C
• Weight: 8 g
• Colour: Silver

How to use

Clean the heatsink and processor surfaces to remove old paste, dust and grease. Apply a small, pea-sized amount of the Nedis COOLP400SI paste to the centre of the CPU or GPU die, then mount the heatsink and secure it according to the manufacturer's instructions; pressure will spread the paste into a thin, even layer. For larger dies or irregular surfaces use a slightly larger amount, but avoid excess that can squeeze out.

Usage recommendations

Store the thermal paste in a cool, dry place. Avoid contact with skin and eyes; wash immediately if contact occurs. Reapply when replacing or reseating the heatsink or if operating temperatures increase noticeably.