Thermal pad Thermal Grizzly Minus Pad Extreme 3.38 g/cm³ 100x120x2 mm

The Thermal Grizzly Minus Pad Extreme 3.38 g/cm³ 100x120x2 mm is a high-density thermal interface pad designed for effective heat transfer between electronic components and heat sinks. Its silicone-based, modelling-clay-like consistency provides a highly flexible surface that conforms to component unevenness, enabling improved contact and thermal conduction. The pad is electrically insulating and available in blue and pink to suit different installation preferences.

Advantages

The Minus Pad Extreme offers very high thermal conductivity and excellent mechanical compliance, allowing it to compensate for microscopic gaps and surface irregularities. Its formulation delivers significantly higher thermal performance compared with earlier generations, supporting demanding cooling tasks such as power regulators and memory ICs. The pad's compressible structure permits optimal surface shaping for maximum contact pressure and heat transfer while maintaining electrical insulation.

Suitable for

• Thermal coupling between power components (voltage regulators, MOSFETs) and heatsinks
• Heat transfer for memory modules and graphics memory
• Cooling solutions in compact or irregularly shaped electronic assemblies
• Replacement of older, lower-conductivity pads in high-performance cooling setups

Key specifications

• Density: 3.38 g/cm³
• Dimensions: 100 mm × 120 mm × 2 mm
• Operating temperature range: -100 °C to 200 °C
• Material base: silicone-based, modelling-clay-like consistency
• Electrical property: electrically insulating
• Available colours: blue, pink
• Single-use recommended due to shaping and compression properties

How to use

Cut the pad to the required size and shape to match the target component and heatsink contact area. Remove any dust, old thermal material, and oils from both surfaces before applying the pad. Place the Minus Pad Extreme between the component and the heatsink, then press to achieve uniform compression and proper contact. Reassemble the device and verify mechanical fit. Because of the pad's modelling-clay-like consistency, avoid repeated removal and reinstallation; the pad is intended for one-time use to maintain optimal thermal performance.

Usage recommendations

Use this thermal pad in applications where high thermal conductivity and electrical insulation are required. Ensure accurate cutting and a clean mating surface for best results. Avoid reuse after removal; replace the pad if disturbed during maintenance. Select the appropriate thickness variant for gap filling to prevent excessive compression or insufficient contact.