Thermal Pad Thermal Grizzly Minus Pad Extreme 3.38 g/cm³ 20mm x 120mm x 2mm

The Thermal Grizzly Minus Pad Extreme 3.38 g/cm³ (20mm x 120mm x 2mm) is a high-density thermal pad designed for efficient heat transfer in high-performance computing environments. Its silicone-based, modelling-clay-like consistency provides a highly flexible surface that compensates for microscopic unevenness between components to maintain close contact and improve thermal conduction. The pad is electrically insulating and intended for one-time application to deliver stable thermal performance for CPUs, GPUs, voltage regulators and memory ICs.

Advantages

The Minus Pad Extreme combines very high thermal conductivity with compressible, form-fitting material that fills gaps and improves contact between heat sources and heatsinks. Its flexible surface and high density allow effective heat transfer even on uneven surfaces. Silicone composition ensures electrical insulation while the improved thermal conductivity—significantly higher than previous Minus Pad variants—supports demanding cooling tasks.

Suitable for

• Thermal interface between chips (CPU, GPU) and heatsinks in high-performance systems
• Cooling of voltage regulator modules (VRMs) and power stages
• Thermal bridging for memory ICs and modules
• Filling small air gaps and surface irregularities on PCBs and components

Key specifications

• Thermal conductivity class: ultra-high (product marketed as improved over previous Minus Pad)
• Density: 3.38 g/cm³
• Dimensions: 20 mm x 120 mm
• Thickness: 2 mm
• Operating temperature range: -100 °C to 200 °C
• Material base: silicone-based, modelling-clay-like consistency
• Electrical property: electrically insulating
• Colours: blue, pink

How to use

Clean both surfaces to be joined (chip and heatsink) from dust, old thermal material and grease, ensuring they are dry and free of contaminants. Cut the Minus Pad Extreme to the required size and gently press it onto the component surface; the pliable material allows shaping to compensate for small height differences. Mount the heatsink and apply even pressure to obtain maximum compression and thermal contact. Because of its modelling-like consistency and compression characteristics, this thermal pad is recommended for single-use installations to ensure optimal performance.

Usage recommendations

For best results, use the pad where reliable electrical insulation and high thermal transfer are required, such as VRMs, memory ICs and tight-fitting CPU/GPU assemblies. Avoid reusing the pad after removal. Ensure proper compression by securing the heatsink according to the component manufacturer's torque specifications and verify clearance to prevent mechanical stress. Store unused pads in a cool, dry place away from direct sunlight.