Thermal grease WPS 25GRAM (25 ml) high thermal conductivity — heat transfer compound

WPS 25GRAM (25 ml) is a thermal grease supplied in a syringe format for thermal interface applications between heatsinks and electronic components. Formulated for high thermal conductivity, this heat transfer compound fills microscopic surface irregularities to improve heat dissipation and support stable operating temperatures for CPUs, GPUs, power modules and compact electronic assemblies under normal operating conditions.

Advantages

The compound offers improved thermal transfer compared with air gaps, thanks to its high thermal conductivity formulation. The syringe dispensing design allows controlled application with minimal waste and easy placement on small or irregular contact surfaces. The paste remains suitable for standard maintenance and replacement cycles and is compatible with typical heatsink mounting arrangements when used according to manufacturer guidelines.

Suitable for

• Desktop and laptop CPUs and GPUs
• Power modules and voltage regulators
• Small form-factor electronics and single-board computers
• Heatsinks, cold plates and thermal pads replacement or augmentation

Key specifications

• Format: syringe (25 ml)
• Function: thermal interface material / heat transfer compound
• Application temperature range: suitable for typical electronic operating ranges (room to elevated operational temperatures)
• Compatibility: designed for use between metal heatsinks and semiconductor packages
• Viscosity and consistency: paste suitable for manual syringe application and spreading

How to use

Clean mating surfaces thoroughly to remove old compound, dust and oils before application. Dispense a small, controlled amount from the 25 ml syringe onto the centre of the component or heatsink contact area and spread evenly if required by the chosen application method. Reassemble the cooling assembly and mount according to system hardware instructions, ensuring even pressure across the interface. Allow normal device operation and monitor temperatures after first use to confirm correct thermal performance.

Usage recommendations

Use only the amount necessary to form a thin, continuous layer between component and heatsink; avoid excessive application which can reduce thermal performance or overflow onto surrounding components. Store the syringe capped in a cool, dry place and follow standard ESD and safety precautions when working with electronic assemblies.