Thermal Interface Paste Phobya 17077, grey, 15×15×3 mm heat sink compound

Phobya 17077 is a grey thermal interface paste supplied in a 15×15×3 mm format intended to improve thermal contact between heat sinks and electronic surfaces. Designed for PC cooling assemblies and small heatsinks, this thin compound fills microscopic gaps and increases heat transfer efficiency where a compact, easy-to-apply layer is required.

Advantages

The thermal paste provides consistent thermal conductivity across mating surfaces and is suitable for confined mounting areas due to its compact dimensions. Its neutral grey color and stable form factor allow for precise placement on small components. The compound reduces thermal resistance between a heat-generating component and a heat sink without requiring sanding or modification of parts.

Suitable for

• Small heatsinks and miniature cooling assemblies in desktop and industrial electronics
• Improving contact between metal heat sinks and processor packages, power regulators, or chips
• Applications where a thin, controlled thermal interface layer is required

Key specifications

• Color: grey
• Dimensions: 15 mm × 15 mm × 3 mm (length × width × thickness)
• Form: solid/packaged thermal interface compound ready for application
• Intended use: thermal interface between heat sink and electronic component

How to use

Ensure both mating surfaces are clean and free of dust, oils, and old compound. Position the Phobya 17077 piece onto the cooler surface or on the component as appropriate, then install the heat sink so the compound is compressed to form a thin, continuous layer. Avoid excessive mechanical stress on components during assembly and verify even contact after mounting.

Usage recommendations

Use in well-ventilated environments and handle with clean tools or gloves to prevent contamination. For best thermal performance, verify that the compound is evenly spread and the contact pressure is uniform. Replace the interface medium if removed or after prolonged service if thermal performance degrades.