Module with soldered Raspberry Pi Pico 2 PIMORONI Pico Jumbo — compact development board module

PIMORONI Pico Jumbo is a compact development module with a pre-soldered Raspberry Pi Pico 2 microcontroller board. The module presents the RP2040-based Pico 2 in a small, ready-to-integrate form factor that simplifies prototyping and embedded applications. It is intended for use in projects where space, reliable soldered connections and quick deployment matter, providing access to the Pico 2’s processing, GPIO and peripheral capabilities without the need to separately mount or solder the board.

Advantages

The soldered configuration eliminates the need for manual header installation and reduces assembly time, lowering the barrier for rapid prototyping and small-series builds. The compact footprint is suitable for projects with limited enclosure space while retaining the Pico 2’s dual-core RP2040 performance and familiar I/O layout. The module form factor supports straightforward mechanical integration and repeated connections in development and field devices.

Suitable for

• Embedded electronics and compact prototypes
• Sensor interfaces and data acquisition modules
• Robotics controllers and motor driver interfaces
• IoT devices and connected stations
• Education, workshops and desktop prototyping

Key specifications

• Processor family: RP2040-based dual-core microcontroller
• Form factor: compact module with pre-soldered development board
• Connectivity: access to general-purpose I/O and standard Pico peripherals
• Mounting: module optimized for direct PCB or enclosure integration
• Use case focus: low-power embedded control, sensors and prototyping

How to use

Install the Pico Jumbo module into your project by soldering the module pads or header points to your target PCB or by securing it mechanically within an enclosure depending on your design. Power and program the module using the standard Pico 2 USB or SWD methods supported by the RP2040 platform; load firmware written in C/C++ or MicroPython according to your application. Route required power, ground and I/O connections to match the module’s pinout and verify signal levels before connecting external sensors, actuators or communication peripherals.

Usage recommendations

Use appropriate decoupling capacitors near power pins and ensure correct voltage levels for connected peripherals. For reliable long-term operation in embedded systems, secure the module mechanically and consider conformal coating or enclosure sealing in harsh environments. During development, keep the module accessible for firmware reprogramming and debugging.