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Thermal paste PROLIMATECH PK-2, thermal conductivity 10.2 W/m·K, 5 g
Thermal paste PROLIMATECH PK-2, thermal conductivity 10.2 W/m·K, 5 g
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Thermal paste PROLIMATECH PK-2, thermal conductivity 10.2 W/m·K, 5 g
Leave your address - as soon as the price of the product goes down, you'll know about it right away
Thermal paste PROLIMATECH PK-2, thermal conductivity 10.2 W/m·K, 5 g
Thermal paste PROLIMATECH PK-2, thermal conductivity 10.2 W/m·K, 5 g
PROLIMATECH PK-2 is a thermal interface compound with a specified thermal conductivity of 10.2 W/m·K and a net weight of 5 g. Developed for improving heat transfer between CPUs, GPUs and heatsinks, PK-2 features low viscosity to enable thin, even spreads that reduce thermal resistance. The paste is supplied in a small 5 g quantity suitable for single or occasional applications during PC cooling upgrades, maintenance or rebuilds.
PK-2 offers a high thermal conductivity rating of 10.2 W/m·K combined with a low-viscosity formula that makes application smooth and precise. The compound is formulated to create close contact between the chip surface and heatsink without requiring excessive pressure or large quantities. Its small 5 g packaging is practical for users who need a high-performance paste in limited amounts.
Clean both the component surface and heatsink mating surface thoroughly to remove old thermal compound, dust and oils. Apply a pea-sized amount of PROLIMATECH PK-2 to the center of the CPU or GPU die or follow your cooler manufacturer’s recommended application pattern. Mount the heatsink and secure it according to the cooler's instructions, allowing the paste to spread and form an even contact layer. If excess compound is squeezed out, clean the edges with isopropyl alcohol and a lint-free cloth.
Use PK-2 for single or occasional applications where high thermal conductivity and easy spreadability are important. Avoid contaminating the paste with dirt or moisture, store the tube capped in a cool, dry place, and replace if the paste changes color or consistency. For optimal thermal transfer, ensure even mounting pressure and a clean mating surface prior to application.
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