Thermal paste PROLIMATECH PK-3 5 g — thermal conductivity 11.2 W/m·K

PROLIMATECH PK-3 5 g is a thermal paste formulated to improve heat transfer between processors and heatsinks. With a thermal conductivity of 11.2 W/m·K, this compound fills microscopic gaps and surface imperfections that impede thermal contact, enabling more efficient cooling for desktop and small-form-factor systems. The product is supplied in a 5 g syringe for precise, controlled application during CPU, GPU or heatsink installation and maintenance.

Advantages

PK-3 uses engineered nano particles to fill air gaps at the interface between a chip and a cooler, increasing contact area and thermal conduction. The 11.2 W/m·K rated conductivity provides a measurable improvement over standard pastes, helping to lower operating temperatures under load. The 5 g syringe package allows for accurate dispensing and minimal waste, suitable for single-system applications or occasional maintenance.

Suitable for

• Applying between CPU and heatsink in desktop PCs
• GPU cooling maintenance and small GPU cooler installations
• Small-form-factor systems where precise application is required
• Cooling upgrades when replacing coolers or thermal pads

Key specifications

• Thermal conductivity: 11.2 W/m·K
• Net weight: 5 g
• Format: syringe for precise dispensing
• Intended use: interface compound for CPU/GPU and heatsinks

How to use

Clean both surfaces thoroughly to remove old compound, dust and oils before application. Apply a small, pea-sized amount of PK-3 to the center of the processor die or follow the spread method recommended for your cooler. Mount the heatsink evenly and secure it according to the cooler manufacturer's instructions to allow the compound to spread and fill microscopic gaps. Reapply when replacing coolers or if thermal performance degrades over time.

Usage recommendations

Use in a well-ventilated area and avoid getting the compound on motherboard components or socket pins. Store the syringe capped at room temperature and keep out of reach of children. For best results, allow a short break-in period under normal operating conditions after installation to achieve stable thermal performance.