Thermal paste PROLIMATECH PK-Zero 8 W/m·K — 5 g thermal interface compound

PROLIMATECH PK-Zero is a thermal interface compound with a rated thermal conductivity of 8 W/m·K supplied in a 5 g tube. Formulated to improve heat transfer between processors, graphics chips and heatsinks, this non-conductive paste fills microscopic surface imperfections to reduce thermal resistance and lower operating temperatures. The compound is designed for straightforward application, does not require burn-in, and offers extended service life with low dry-out characteristics.

Advantages

PK-Zero combines relatively high thermal conductivity with a formulation that is electrically non-conductive, enabling safe use around delicate electronic components. The paste is easy to spread and apply evenly, contains nanoparticles that enhance surface contact, and is manufactured to provide stable performance over time with minimal shrinkage or hardening.

Suitable for

• Desktop CPUs and multi-core processors
• Discrete graphics cards and GPU cooling solutions
• Aftermarket CPU coolers and all-in-one liquid cooler cold plates
• High-performance small form-factor systems and workstations
• Other electronic devices and power components requiring improved heat transfer

Key specifications

• Thermal conductivity: 8 W/m·K
• Density: 2.6 g/cm³
• Packaging: 5 g tube for controlled application
• Electrical properties: non-electrically conductive
• Consistency: spreadable paste suitable for thin, uniform layers
• Lifespan characteristics: low dry-out and long-term stability

How to use

Clean both contact surfaces with isopropyl alcohol and a lint-free cloth to remove old compound, dust and oils. Apply a small, pea-sized amount of PK-Zero to the center of the CPU or GPU die or follow the manufacturer-specific pattern for your cooler. Mount the heatsink or cold plate and secure it with even pressure to spread the paste into a thin, continuous layer. There is no required burn-in period; verify mounting and temperatures after initial operation and recheck thermal interface if the cooler is removed.

Usage recommendations

Use minimal paste to achieve a thin, continuous layer—excess compound can reduce thermal transfer efficiency. Store the tube capped in a cool, dry place and avoid contaminating the tip. For critical or extreme overclocking scenarios, monitor temperatures during initial runs and consider reapplying if the cooling solution is changed.