Thermal paste QOLTEC 51634 – heat sink compound for CPU/GPU cooling

QOLTEC 51634 is a thermally conductive paste formulated to improve thermal transfer between CPUs or GPUs and heatsinks. This heat sink compound creates a uniform thermal interface that fills microscopic gaps and irregularities on contact surfaces, helping to reduce operating temperatures and improve the efficiency of cooling systems in desktop PCs and laptops. The product is electrically insulating, easy to apply, and designed for long-term stability without rapid degradation of thermal properties.

Advantages

The thermal paste offers high thermal conductivity combined with electrical insulation, enabling safer application around sensitive components. Its consistency allows it to perfectly fill micro-gaps and uneven surfaces, ensuring reliable heat flow from the processor to the heatsink. The compound is easy to spread during assembly or maintenance and maintains its performance over extended use without frequent replacement.

Suitable for

• Replacing or applying thermal interface material on desktop CPU and GPU coolers
• Thermal maintenance and upgrades of laptop processors and graphics chips
• PC building, overclocking setups where improved heat transfer is required
• Repair and refurbishment of cooling solutions in compact electronics

Key specifications

• Form: thermally conductive paste suitable for manual application
• Electrical properties: electrically insulating to reduce short-circuit risk
• Thermal behavior: high thermal conductivity for efficient heat transfer
• Application properties: smooth consistency for easy spreading and gap filling
• Durability: stable performance designed for long-term use without rapid drying or separation

How to use

Clean the contact surfaces of the processor and heatsink from old thermal material and contaminants using an appropriate solvent, then allow surfaces to dry. Apply a small, pea-sized amount of QOLTEC 51634 onto the centre of the processor die or use a thin, even layer on the heatsink base depending on your preferred method. Reattach the heatsink with even pressure to spread the compound and eliminate air pockets. Ensure screws or mounting clips are fastened to the manufacturer's recommended torque or pressure for reliable contact.

Usage recommendations

For best results, use the paste sparingly—excess material can increase thermal resistance. Avoid applying on exposed electrical contacts despite the compound’s insulating properties, and store the product in a cool, dry place with the cap secured to prevent contamination or drying. Inspect thermal performance during routine maintenance and reapply only if thermal performance degrades or if the heatsink is removed.