Thermal paste QOLTEC 51641, thermal conductivity 3.05 W/m·K, 0.5 g, gold

QOLTEC 51641 is a thermally conductive paste formulated to improve heat transfer between electronic components and heat sinks. Supplied in a 0.5 g syringe, the gold-coloured compound offers thermal conductivity of 3.05 W/m·K and low thermal resistance of 0.073 °C/W, making it suitable for small-scale cooling tasks where precise application and reliable contact are required. The paste is electrically insulating and designed to fill microscopic gaps between a processor or power device and its cooling base, improving heat dissipation without compromising electrical isolation.

Advantages

The formulation combines relatively high thermal conductivity with electrical insulation, allowing safe use on CPU, GPU and power devices where conductive pastes are unsuitable. Its paste-like consistency enables easy, controlled application from the 0.5 g syringe, while stability over time ensures that the compound maintains thermal performance without frequent reapplication. The gold colour helps visual confirmation of coverage during installation.

Suitable for

• Thermal interface between CPUs or GPUs and small heat sinks
• Power transistors and voltage regulators in compact electronics
• Repair and maintenance of small consumer electronics with limited contact areas
• Applications requiring electrically insulating thermal transfer

Key specifications

• Thermal conductivity: 3.05 W/m·K
• Thermal resistance: 0.073 °C/W (manufacturer data)
• Net weight: 0.5 g (0.0005 kg)
• Product colour: gold
• Supply form: single syringe for precise application

How to use

Ensure both mating surfaces are clean, dry and free of old thermal compound, dust or oils before application. Apply a small amount of QOLTEC 51641 to the centre of the component or heat sink contact area and spread evenly if required, or allow pressure from the heat sink to distribute the paste. Mount the heat sink according to the device manufacturer’s instructions to obtain a thin, continuous thermal layer. Wipe away any excess with a lint-free cloth and isopropyl alcohol if necessary.

Usage recommendations

Use the syringe sparingly: a thin, uniform layer provides optimal thermal contact. Avoid applying paste to exposed electronics where mechanical pressure could squeeze it into connectors. Store the syringe in a cool, dry place and reseal it after use to preserve consistency and prevent contamination.