Heat Sink Compound Qoltec 51644

Qoltec 51644 heat sink compound is a thermally conductive paste designed to improve heat transfer between electronic components and cooling systems. With a thermal conductivity of 3.05 W/m·K and a thermal resistance of 0.073 °C/W, this 100 g tube provides a balance of efficient thermal performance and electrical insulation. The compound fills microscopic gaps between a processor and its heatsink, promoting stable temperatures and supporting long-term component reliability.

Advantages

The Qoltec 51644 compound combines relatively high thermal conductivity with insulating properties, allowing safe use where electrical isolation is required. Its smooth, easy-to-spread consistency ensures even coverage and effective contact between surfaces. Formulated for durability, the paste maintains its thermal properties over extended use without frequent reapplication.

Suitable for

• CPU and GPU heat sink assembly and re-application
• Cooling systems in desktop computers and workstations
• Power electronics and small form-factor devices requiring thermal interface material
• Repair and maintenance of electronic modules with heat-producing components

Key specifications

• Thermal conductivity: 3.05 W/m·K
• Thermal resistance: 0.073 °C/W
• Net weight: 100 g
• Electrical behavior: electrically insulating
• Consistency: easy-to-apply, spreadable paste

How to use

Before application, power off the device and disconnect it from any power source. Clean both mating surfaces thoroughly to remove old compound, dust and grease, using isopropyl alcohol and a lint-free cloth. Apply a small, even amount of Qoltec 51644 to the center of the processor or component and mount the heatsink, allowing the compound to spread under pressure. If needed, remove and reapply to ensure correct coverage. Follow device manufacturer torque or mounting guidelines to avoid uneven pressure.

Usage recommendations

For best results, store the product in a cool, dry place and keep the cap tightly closed when not in use. Use the paste in ambient conditions recommended for the device, and avoid contaminating the compound with dust or moisture. When replacing or reapplying thermal paste, inspect the heatsink and contact surface for warping or damage that could impede thermal transfer.