Thermal paste QOLTEC 51645 — thermal conductivity 3.17 W/m·K, 1 g, silver

QOLTEC 51645 is a silver-coloured thermal paste formulated to improve heat transfer between CPUs, GPUs and heatsinks. With a thermal conductivity of 3.17 W/m·K and thermal resistance of 0.067 °C/W supplied in a 1 g pack, the compound is intended for small repairs, upgrades and maintenance where a thin, thermally conductive interface is required. The paste is easy to apply, fills micro-gaps between the processor and cooling base, and is designed to retain its properties during prolonged use.

Advantages

The compound offers relatively high thermal conductivity for its class while remaining electrically non-destructive in ordinary applications. Its silver colour and smooth consistency allow accurate placement and even spreading on small surfaces. Supplied in a compact 1 g package, it suits targeted interventions and component-level maintenance without excess material waste.

Suitable for

• Thermal interface between CPU or GPU and heatsink during repairs or upgrades
• Cooling contact for small electronics and single-board computers
• Replacement or topping-up of degraded thermal compound in laptops, desktops or graphics cards
• Prototyping and testing where a thin, conductive thermal layer is needed

Key specifications

• Thermal conductivity: 3.17 W/m·K
• Thermal resistance: 0.067 °C/W
• Weight: 1 g
• Colour: Silver
• Form: paste for thermal interface use

How to use

Clean both mating surfaces (processor and heatsink) from old compound, dust and grease using isopropyl alcohol and a lint-free cloth. Apply a small, pea-sized amount of QOLTEC 51645 to the centre of the processor die or use a thin line/dot according to the CPU/GPU package. Mount the heatsink and secure it with even pressure so the paste spreads into a thin, continuous layer. After assembly, power the system and verify operating temperatures under typical load to ensure correct coverage and thermal contact.

Usage recommendations

Store the product at room temperature in a dry place and avoid contamination of the paste with dirt or fingers. Use a minimal, even amount to avoid excess squeeze-out; for repeated disassembly, clean and replace the paste rather than reusing contaminated residue. Not intended as an electrical conductor; avoid applying to exposed electrical contacts.