Thermal paste QOLTEC 51650 — thermal conductivity 4.63 W/m·K, grey, 1 g

QOLTEC 51650 thermal paste is a grey, high-conductivity compound designed to improve heat transfer between processors, graphics chips, heatsinks and other electronic components. Supplied as a 1 g dose, the paste has a specified thermal conductivity of 4.63 W/m·K and thermal resistance of 0.0087 °C/W. It fills microscopic gaps at the interface, reducing thermal impedance and enabling more efficient cooling in precision rework, small repairs and component assembly.

Advantages

The thermal compound combines relatively high thermal conductivity with electrical insulation, enabling safe use around sensitive circuits. Its texture allows easy and accurate application for small areas or component-level work. The formula is stable over time and does not require frequent replacement under normal operating conditions.

Suitable for

• Thermal interface material between CPU or GPU and heatsink in desktops and laptops (small doses)
• Precision rework and component-level repairs where controlled application is required
• Filling micro-gaps on cooling bases, heat spreaders and small electronic modules

Key specifications

• Thermal conductivity: 4.63 W/m·K
• Thermal resistance: 0.0087 °C/W
• Weight: 1 g
• Colour: Grey
• Electrical behaviour: insulating (not electrically conductive)

How to use

Clean both mating surfaces to remove old thermal compound, dust and oils before applying the paste. Apply a small, controlled amount of QOLTEC 51650 to the center of the chip or heat source and spread thinly and evenly if required, or allow the heatsink pressure to distribute the compound. Reassemble the cooling assembly following manufacturer torque or mounting guidelines to ensure consistent contact and pressure. Use minimal quantity appropriate for the surface area to avoid overflow onto surrounding components.

Usage recommendations

Store the product at room temperature in a dry place. For optimal performance, perform application on clean, dry surfaces and avoid contaminating the paste with dust or conductive residues. Because the package contains a small quantity (1 g), it is best suited for single or occasional small repairs rather than repeated large-scale applications.