Thermal paste QOLTEC 51651, thermal conductivity 4.63 W/m·K, 0.5 g, grey

QOLTEC 51651 thermal paste is a grey heat-conductive compound formulated to improve heat transfer between electronic components and heatsinks. With a thermal conductivity of 4.63 W/m·K and a thermal resistance of 0.0087 °C/W, this 0.5 g syringe is designed for efficient thermal coupling in CPUs, GPUs, power modules and compact electronics where reliable dissipation is required. The paste fills microscopic gaps between mating surfaces, is electrically insulating, and remains stable over prolonged use without significant degradation of thermal properties.

Advantages

The compound combines relatively high thermal conductivity with electrical insulation, allowing safe use on components where electrical contact must be avoided. Its grey, smooth consistency spreads evenly across surfaces and reliably fills micro-gaps to reduce thermal resistance. The formulation is long-lasting and retains its thermal performance over time, while the small 0.5 g dose is convenient for single repairs or occasional reapplications. Application is straightforward thanks to a user-friendly syringe form factor.

Suitable for

• Thermal interface between CPUs and heatsinks in desktop or laptop repairs
• GPU heatsink assemblies in graphics cards or small form-factor systems
• Power modules and voltage regulators requiring thermal conduction without electrical contact
• Compact electronic devices and consumer electronics with limited cooling space

Key specifications

• Thermal conductivity: 4.63 W/m·K
• Thermal resistance: 0.0087 °C/W
• Net weight: 0.5 g (0.0005 kg)
• Colour: Grey
• Form: Paste supplied in a small applicator/syringe
• Electrical behaviour: Insulating (non-conductive)

How to use

Ensure both mating surfaces (processor and heatsink) are clean, dry and free of old thermal compound or contaminants. Apply a small, pea-sized amount of QOLTEC 51651 to the centre of the component surface, then mount the heatsink and secure it according to the device manufacturer's instructions; the pressure will spread the paste into an even layer. For larger surfaces or uneven contacts, a thin, uniform film may be spread with a suitable applicator before seating the heatsink. Avoid excessive application — a thin continuous layer provides the best thermal transfer.

Usage recommendations

Store the thermal paste at room temperature in a dry place and keep the applicator cap closed when not in use. Use personal protective gloves if skin contact is a concern and clean any excess paste from surrounding components to prevent contamination. Reapply when replacing or reseating heatsinks or if thermal performance degrades; for typical consumer devices this may be necessary after extended service life or when performing maintenance.