Thermal paste QOLTEC 51655 — thermal conductivity 5.15 W/m·K, 1 g, grey

QOLTEC 51655 is a grey thermal paste designed to improve heat transfer between electronic components and heatsinks. With a thermal conductivity of 5.15 W/m·K and low thermal resistance of 0.004 °C/W in a compact 1 g package, it is intended for small-scale cooling interfaces where precise application and low thermal resistance are required. The compound is electrically insulating while providing efficient thermal conduction, fills micro-gaps between a processor and cooling base, and is formulated for long-term stability without rapid degradation of properties.

Advantages

The paste combines relatively high thermal conductivity with electrical insulation, enabling safe use on components where conductive pastes are not suitable. Its grey, non-runny consistency makes it easy to apply accurately in small amounts, reducing waste and ensuring consistent thermal contact. Low thermal resistance and stable formulation support sustained heat transfer over prolonged use, and the small 1 g tube is convenient for targeted maintenance or single-component applications.

Suitable for

• CPUs and laptop processors in repair or maintenance tasks
• GPUs and graphics card cooling interfaces
• Power transistors and discrete semiconductor devices
• Small heatsinks and embedded electronics with limited contact area

Key specifications

• Thermal conductivity: 5.15 W/m·K
• Thermal resistance: 0.004 °C/W
• Net weight: 1 g (0.001 kg)
• Colour: Grey
• Electrical characteristic: electrically insulating (non-conductive)
• Consistency: easy-to-apply paste suitable for fine application

How to use

Clean contact surfaces thoroughly to remove old paste, dust and grease before applying QOLTEC 51655. Apply a small, even amount of thermal paste onto the center of the component heat spreader or heatsink mounting area; a thin, continuous layer is sufficient because the compound is formulated to fill micro-gaps under mounting pressure. Mount the heatsink or cooler and secure it with even pressure to spread the paste into a uniform interface. If excess material squeezes out, remove it carefully with a lint-free cloth and appropriate solvent. Use the 1 g package for one or a few precise applications rather than bulk rework.

Usage recommendations

Store the paste in a cool, dry place and ensure the cap is tightly closed after use to maintain consistency. For best thermal performance, avoid applying excessive amounts; too thick a layer can reduce heat transfer efficiency. Replace thermal paste during major cooling maintenance or whenever thermal interface degradation is suspected based on temperature monitoring.