Thermal paste RAMPAGE TM-220 2 g, thermal conductivity 11 W/m·K, includes spatula and IPA

RAMPAGE TM-220 is a 2 g thermal paste formulated to improve heat transfer between processors or graphics chips and their heatsinks. With a declared thermal conductivity of 11 W/m·K, the compound is intended for use in desktop and laptop cooling assemblies where reducing thermal resistance at the interface helps maintain lower component temperatures and stable operation. The package includes a small spatula for controlled spreading and an IPA wipe for surface cleaning prior to application.

Advantages

The high nominal thermal conductivity supports efficient dissipation of heat from the chip to the heatsink. Its 2 g quantity is suitable for multiple small applications or a single full CPU/GPU application, and the included spatula enables a thin, even layer to be applied without excess. The supplied isopropyl alcohol wipe facilitates removal of old compound and cleaning of mating surfaces to ensure optimal contact and consistent thermal performance.

Suitable for

• Thermal interface between CPU and air or liquid cooler in desktop PCs
• Thermal contact for GPU heatsinks and custom graphics cooling solutions
• Refurbishing or reapplying thermal paste on laptop processors and compact systems
• Small electronics and embedded boards requiring improved thermal conduction

Key specifications

• Mass: 2 g
• Declared thermal conductivity: 11 W/m·K
• Consistency: paste for manual application
• Included accessories: small spatula for spreading, IPA wipe for surface cleaning
• Intended contact: CPU/GPU to heatsink interface

How to use

Begin by powering down the system and grounding yourself to avoid electrostatic discharge. Remove the heatsink and use the included IPA wipe to clean old thermal paste from both the chip and heatsink surfaces, allowing them to dry fully. Apply a small, pea-sized amount or a thin line of the thermal paste to the center of the processor die area, then use the spatula to spread a thin, uniform layer covering the contact area without excessive overflow. Reattach the heatsink with even pressure according to the cooler manufacturer's instructions and verify secure mounting before powering on the system.

Usage recommendations

For best results, clean mating surfaces thoroughly and apply only a thin, continuous layer to minimize thermal resistance. Avoid using excessive amounts of paste, which can reduce effectiveness. Reapply thermal paste when replacing or reseating the heatsink, or if operating temperatures rise noticeably over time.