Thermal Pad RAMPAGE XTP-001 38×38×0.2 mm PTM for heat transfer

RAMPAGE Termopad XTP-001 is a PTM thermal pad measuring 38×38×0.2 mm, engineered to improve thermal contact between electronic components and heatsinks. The thin 0.2 mm profile is intended to fill small surface irregularities and microscopic gaps, enabling more efficient heat transfer from chips, power modules, and other heat-generating parts to cooling elements. The pad is suitable for tight assemblies where a low-profile thermal interface material is required and for use in PCs, laptops and compact electronic devices.

Advantages

The RAMPAGE XTP-001 offers a uniform, soft interface that conforms to uneven surfaces while maintaining a stable thermal path. Its minimal thickness reduces the risk of mechanical interference in compact builds and supports reliable heat conduction for small components. The pad is simple to cut to size for custom applications and provides consistent performance over repeated installation cycles when handled and placed correctly.

Suitable for

• Thermal coupling between ICs, MOSFETs, and heatsinks in compact PC builds
• Cooling modules and power electronics in laptops and small form-factor devices
• Filling minor gaps in cooling assemblies and component-to-heatsink interfaces
• Retrofit or repair tasks where a thin thermal interface is required

Key specifications

• Material type: PTM thermal pad
• Dimensions: 38 × 38 × 0.2 mm
• Thickness: 0.2 mm (low-profile)
• Form: soft, conformable pad suitable for minor surface irregularities
• Typical applications: chips, power modules, cooling assemblies in compact electronics

How to use

Clean both contact surfaces to remove dust, grease, and old thermal materials prior to placement. Cut the pad to the required dimensions if necessary, peel off protective liners if present, and position the pad directly between the component and heatsink, ensuring full coverage of the heat source. Apply even, gentle pressure to seat the pad and eliminate trapped air. Reassemble the device following manufacturer torque and mounting recommendations to maintain correct mechanical contact.

Usage recommendations

Store unused pads in a clean, dry environment away from direct sunlight and extreme temperatures. For best thermal performance, avoid using the pad in applications where a thicker gap must be bridged; select an appropriate thickness for larger gaps. During installation, handle the pad with clean hands or gloves to prevent contamination of thermal surfaces.