Thermal pad RAMPAGE XTP-002 31×50×0.2 mm PTM — silicone thermal interface

RAMPAGE XTP-002 is a silicone thermal pad sized 31×50×0.2 mm designed to act as an efficient thermal interface between electronic components and heatsinks. The pad fills small surface irregularities and maintains thermal contact where thermal paste is impractical or undesirable, providing stable heat transfer for chips, power modules, VRMs and other PCB-mounted components in computers and electronics.

Advantages

The silicone construction offers consistent compressibility and electrical insulation while maintaining thermal conductivity across the interface. Its thin 0.2 mm profile allows for minimal added gap thickness, improving contact with low-clearance components. The pre-cut dimensions make it quick to place without trimming, reducing installation time and the risk of applying excess material.

Suitable for

• Thermal bridging between IC packages and low-profile heatsinks
• Cooling of VRMs and MOSFET arrays on motherboards
• Heat transfer for power modules and DC–DC converters
• Filling small gaps on PCBs where thermal paste cannot be used

Key specifications

• Material: silicone-based thermal pad
• Dimensions: 31 × 50 mm
• Thickness: 0.2 mm
• Function: thermal interface / gap filler
• Electrical characteristics: electrically insulating (silicone)

How to use

Ensure both surfaces (component and heatsink) are clean, dry and free of dust or old thermal compounds. Remove any protective liners from the pad, align it carefully over the component and press gently to achieve uniform contact. If necessary, cut the pad to the required shape before placement using a sharp blade or scissors. Reassemble the cooling assembly and apply even mechanical pressure to maintain contact without overstressing components.

Usage recommendations

Use this thermal pad where minimal thickness and electrical insulation are required. Avoid stretching the pad during installation. For applications with large gaps or where higher thermal conductivity is essential, consider thicker pads or alternative thermal interface materials. Store unused pads in a dry, dust-free environment away from direct sunlight to preserve material properties.