Leave your address - as soon as the price of the product goes down, you'll know about it right away
Heat sink for Raspberry Pi 5, Raspberry SC1159 accessory, Red and White
Heat sink for Raspberry Pi 5, Raspberry SC1159 accessory, Red and White
In cart {{totalProductsCount}} item(s)
Your cart is empty
Heat sink for Raspberry Pi 5, Raspberry SC1159 accessory, Red and White
Leave your address - as soon as the price of the product goes down, you'll know about it right away
Heat sink for Raspberry Pi 5, Raspberry SC1159 accessory, Red and White
Heat sink for Raspberry Pi 5, Raspberry SC1159 accessory, Red and White
Passive heat sink accessory designed for Raspberry Pi 5 boards, model SC1159 by Raspberry in red and white. The component attaches to the system-on-chip and nearby heat-generating elements to improve thermal dissipation, helping the board maintain stable performance during sustained CPU or GPU load. It is a low-noise, maintenance-free cooling solution suitable for compact installations where airflow may be limited.
The heat sink provides improved heat transfer away from critical components without requiring fans or additional power. Its compact form factor and colour-matched design integrate with Raspberry Pi 5 setups while occupying minimal board space. Being a passive solution, it operates silently and requires no moving parts, reducing failure modes and maintenance needs. The construction materials and surface area are optimised to increase convection and conduction from the chip to ambient air.
Ensure the Raspberry Pi 5 board is powered off and disconnected from power. Clean the surface of the system-on-chip and surrounding components from dust and oils using isopropyl alcohol or a lint-free cloth. Align the heat sink with the chip and any indicated contact points, then attach using the supplied thermal interface material or adhesive backing according to the manufacturer's instructions. Reassemble any enclosure and power the board to verify normal operation and that the heat sink is secure. Regularly inspect the attachment and surrounding area for dust buildup if the board operates in a dusty environment.
The passive heat sink is suitable for lowering operating temperatures in applications with moderate continuous load; for prolonged high-power workloads or constrained ambient conditions, consider using additional active cooling or improving case ventilation to maintain optimal thermal performance.
{{highlightedFeature.featureTitle}}:
{{getProductFeatureValueById(product, highlightedFeature.featureId)}}