Thermal Paste SCYTHE Polartherm X-10, thermal compound, 2 g syringe

SCYTHE Polartherm X-10 is a 2 g thermal compound supplied in a syringe, designed for use between CPUs, GPUs and other heat-generating components and their heatsinks. The paste improves thermal contact by filling microscopic gaps and voids on mating surfaces, enabling more efficient heat transfer in desktop and small-form-factor systems. The syringe format allows controlled application during cooler installation, graphics card maintenance or component repasting.

Advantages

Polartherm X-10 offers consistent thermal conductivity in a compact 2 g package suited to single or occasional repasting tasks. The syringe dispenser enables precise application and reduces waste compared with bulk tubs. Its formulation is non-curing, so it remains pliable after application and does not require break-in time associated with some adhesive thermal pads. The compound is electrically non-conductive, reducing the risk of short circuits when applied correctly to processor and GPU surfaces.

Suitable for

• Desktop CPU cooler installation and replacement
• Graphics card thermal maintenance and repasting
• Small-form-factor and compact PC builds with limited workspace
• Repair shops and hobbyist system upgrades where precise dispensing is needed

Key specifications

• Net quantity: 2 g thermal compound
• Form: syringe dispenser for controlled application
• Compatibility: intended for use between metal heatsinks and silicon-based processors or GPU dies
• Electrical properties: non-conductive formulation (apply according to manufacturer guidance)
• Physical characteristics: paste that remains pliable after application (non-curing)

How to use

Clean both mating surfaces thoroughly with isopropyl alcohol and a lint-free cloth to remove old thermal material and contaminants. Apply a small, pea-sized amount of Polartherm X-10 to the center of the processor or GPU die, or use a thin line for elongated surfaces, taking care to avoid excess. Mount the heatsink with even pressure to spread the compound into a thin, uniform layer. If removal is required later, clean surfaces again with isopropyl alcohol and replace the compound before reassembly.

Usage recommendations

Use the syringe tip for controlled dosing and store the product capped in a cool, dry place. Avoid applying the compound to electrical contacts or socket pins. For best thermal results, ensure even heatsink mounting pressure and replace the compound if hardware is removed or after extended service intervals.